{"id":306,"date":"2016-08-25T12:50:34","date_gmt":"2016-08-25T12:50:34","guid":{"rendered":"http:\/\/emsl.kw.ac.kr\/?page_id=306"},"modified":"2025-01-02T10:22:28","modified_gmt":"2025-01-02T10:22:28","slug":"introduction-3","status":"publish","type":"page","link":"http:\/\/emsl.kw.ac.kr\/","title":{"rendered":"RESEARCH TOPICS"},"content":{"rendered":"<ul>\n<li>\n<h3><a href=\"https:\/\/emslab.notion.site\/\"><span style=\"color: #666699;\"><strong><em>Click and Check Out Our New Space on Notion !<\/em><\/strong><\/span><\/a><\/h3>\n<\/li>\n<\/ul>\n<hr \/>\n<h3>1. System-level Electromagnetic Compatibility\/ Interference (EMC\/EMI)<\/h3>\n<p><a href=\"http:\/\/emsl.kw.ac.kr\/wp-content\/uploads\/2022\/05\/emic.jpg\"><img loading=\"lazy\" class=\"alignnone wp-image-632\" src=\"http:\/\/emsl.kw.ac.kr\/wp-content\/uploads\/2022\/05\/emic-1024x505.jpg\" alt=\"\" width=\"600\" height=\"296\" srcset=\"http:\/\/emsl.kw.ac.kr\/wp-content\/uploads\/2022\/05\/emic-1024x505.jpg 1024w, http:\/\/emsl.kw.ac.kr\/wp-content\/uploads\/2022\/05\/emic-300x148.jpg 300w, http:\/\/emsl.kw.ac.kr\/wp-content\/uploads\/2022\/05\/emic-768x379.jpg 768w, http:\/\/emsl.kw.ac.kr\/wp-content\/uploads\/2022\/05\/emic-624x308.jpg 624w, http:\/\/emsl.kw.ac.kr\/wp-content\/uploads\/2022\/05\/emic.jpg 1160w\" sizes=\"(max-width: 600px) 100vw, 600px\" \/><\/a><\/p>\n<ul>\n<li>Inter-system EMI : Radiated Emission\/Susceptibility (RE\/RS)<\/li>\n<li>Intra-system EMI : Radio-frequency Interference (RFI)<\/li>\n<li>Component-level Evaluation of RE\/RFI for Mobile Devices<\/li>\n<li>Sensitivity and Immunity Analysis for Mobile Communication Systems<\/li>\n<\/ul>\n<h3>2. Advanced Electromagnetic Noise Characterization Technologies<\/h3>\n<p><a href=\"http:\/\/emsl.kw.ac.kr\/wp-content\/uploads\/2014\/03\/meas.bmp\"><img loading=\"lazy\" class=\"alignnone wp-image-105\" src=\"http:\/\/emsl.kw.ac.kr\/wp-content\/uploads\/2014\/03\/meas.bmp\" alt=\"meas\" width=\"600\" height=\"173\" \/><\/a><\/p>\n<ul>\n<li>High-sensitivity EM Probe Design (E\/H-field)<\/li>\n<li>Near-field Measurement Techniques : Calibration \/ Compensation<\/li>\n<li>Noise Source Characterization and Modeling<\/li>\n<\/ul>\n<h3>3. High-speed Digital System Design (SI\/PI)<\/h3>\n<p><a href=\"http:\/\/emsl.kw.ac.kr\/wp-content\/uploads\/2024\/12\/HSI_modeling.jpg\"><img loading=\"lazy\" class=\"wp-image-802 alignnone\" src=\"http:\/\/emsl.kw.ac.kr\/wp-content\/uploads\/2024\/12\/HSI_modeling.jpg\" alt=\"\" width=\"600\" height=\"296\" srcset=\"http:\/\/emsl.kw.ac.kr\/wp-content\/uploads\/2024\/12\/HSI_modeling.jpg 951w, http:\/\/emsl.kw.ac.kr\/wp-content\/uploads\/2024\/12\/HSI_modeling-300x148.jpg 300w, http:\/\/emsl.kw.ac.kr\/wp-content\/uploads\/2024\/12\/HSI_modeling-768x379.jpg 768w, http:\/\/emsl.kw.ac.kr\/wp-content\/uploads\/2024\/12\/HSI_modeling-624x308.jpg 624w\" sizes=\"(max-width: 600px) 100vw, 600px\" \/><\/a><\/p>\n<ul>\n<li>Multi-gigabit Interconnects Design : PKG, PCB, Cable, Connector<\/li>\n<li>Si-interposer\/RDL Modeling for Advanced Package Design<\/li>\n<\/ul>\n<p><a href=\"http:\/\/emsl.kw.ac.kr\/wp-content\/uploads\/2022\/05\/HSDSR.jpg\"><img loading=\"lazy\" class=\"wp-image-633 alignnone\" src=\"http:\/\/emsl.kw.ac.kr\/wp-content\/uploads\/2022\/05\/HSDSR-1024x460.jpg\" alt=\"\" width=\"600\" height=\"269\" srcset=\"http:\/\/emsl.kw.ac.kr\/wp-content\/uploads\/2022\/05\/HSDSR-1024x460.jpg 1024w, http:\/\/emsl.kw.ac.kr\/wp-content\/uploads\/2022\/05\/HSDSR-300x135.jpg 300w, http:\/\/emsl.kw.ac.kr\/wp-content\/uploads\/2022\/05\/HSDSR-768x345.jpg 768w, http:\/\/emsl.kw.ac.kr\/wp-content\/uploads\/2022\/05\/HSDSR-624x280.jpg 624w, http:\/\/emsl.kw.ac.kr\/wp-content\/uploads\/2022\/05\/HSDSR.jpg 1392w\" sizes=\"(max-width: 600px) 100vw, 600px\" \/><\/a><\/p>\n<ul>\n<li>High-speed Signal\/Power Integrity (SI\/PI) in Chip-PKG-System Co-design<\/li>\n<li>High-speed Digital Signal Recovery based on Equalization Techniques<\/li>\n<\/ul>\n","protected":false},"excerpt":{"rendered":"<p>Click and Check Out Our New Space on Notion ! 1. System-level Electromagnetic Compatibility\/ Interference (EMC\/EMI) Inter-system EMI : Radiated Emission\/Susceptibility (RE\/RS) Intra-system EMI : Radio-frequency Interference (RFI) Component-level Evaluation of RE\/RFI for Mobile Devices Sensitivity and Immunity Analysis for Mobile Communication Systems 2. Advanced Electromagnetic Noise Characterization Technologies High-sensitivity EM Probe Design (E\/H-field) Near-field [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"open","ping_status":"open","template":"page-templates\/front-page.php","meta":[],"_links":{"self":[{"href":"http:\/\/emsl.kw.ac.kr\/index.php?rest_route=\/wp\/v2\/pages\/306"}],"collection":[{"href":"http:\/\/emsl.kw.ac.kr\/index.php?rest_route=\/wp\/v2\/pages"}],"about":[{"href":"http:\/\/emsl.kw.ac.kr\/index.php?rest_route=\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"http:\/\/emsl.kw.ac.kr\/index.php?rest_route=\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"http:\/\/emsl.kw.ac.kr\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=306"}],"version-history":[{"count":30,"href":"http:\/\/emsl.kw.ac.kr\/index.php?rest_route=\/wp\/v2\/pages\/306\/revisions"}],"predecessor-version":[{"id":811,"href":"http:\/\/emsl.kw.ac.kr\/index.php?rest_route=\/wp\/v2\/pages\/306\/revisions\/811"}],"wp:attachment":[{"href":"http:\/\/emsl.kw.ac.kr\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=306"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}