{"id":85,"date":"2014-03-29T07:26:05","date_gmt":"2014-03-29T07:26:05","guid":{"rendered":"http:\/\/emsl.kw.ac.kr\/?page_id=85"},"modified":"2024-11-09T02:30:18","modified_gmt":"2024-11-09T02:30:18","slug":"intl-conference","status":"publish","type":"page","link":"http:\/\/emsl.kw.ac.kr\/?page_id=85","title":{"rendered":"INTL. CONFERENCE"},"content":{"rendered":"
    \n
  1. Eakhwan Song<\/strong>, “Impact of Electric Field Coupling on High-frequency Magnetic Probe Calibration,” in Proceedings of <\/span> 2024 International Symposium on Antennas and Propagation, <\/span>Incheon, Republic of Korea, November 5-8, 2024. <\/span><\/li>\n
  2. Hyun Ho Park, Jiseong Kim, Eakhwan Song<\/strong>, Hongseok Kim and Sangho Cho, “Influence of Sensing Resistor on IC-level Noise Measurement of DC-DC Converters by 1 <\/span>\u2126 <\/span>Method<\/span>,” in Proceedings of the 14th International Workshop on Electromagnetic Compatibility of Integrated Circuits, Torino, Italy, October 7-9, 2024.<\/li>\n
  3. Gyeongchan Jang, Jiseong Kim, Hyun Ho Park and Eakhwan Song<\/strong>, “Segmented Cavity Design for Suppression of Cavity-to-Via Coupling in High-Speed Transmission Lines of Multi-Layer Printed Circuit Boards,” in Proceedings of the 28th IEEE Workshop on Signal and Power Integrity, Lisbon, Portugal, May 12-15, 2024.<\/li>\n
  4. Eakhwan Song<\/strong>, Changhoon Sim, Kyungsub Lee, Tai Woong Ha, Sanguk Lee and Jiseong Kim, “Evaluation of High-Speed Signal Transmission Characteristics of Self Assembling Anisotropic Conductive Adhesives (SACA),” in Proceedings of the 2023 International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, October 25-27, 2023.<\/li>\n
  5. Joojoong Kim<\/strong> and Eakhwan Song<\/strong>, “An Efficient Neural Network Learning Algorithm for Printed Spiral Coil (PSC) Impedance Prediction,” in Proceedings of the 2023 International Symposium and Exhibition on Electromagnetic Compatibility, Krakow, Poland, September 4-8, 2023.<\/li>\n
  6. Junho Joo<\/strong> and Eakhwan Song<\/strong>, “Investigation of Conducted Noise Impact on a Wireless Power Transfer System with Bifurcation Phenomena,” in Proceedings of the 2019 Asia-Pacific International Symposium on Electromagnetic Compatibility, Sapporo, Japan, June 3-7, 2019, pp. 609.<\/li>\n
  7. Junho Joo<\/strong>, Sang-Il Kwak, Jonghwa Kwon and Eakhwan Song<\/strong>, “Simulation-based Conducted Susceptibility Testing for Wireless Power Transfer (WPT) Systems,” in Proceedings of the 2018 Asia-Pacific International Symposium on Electromagnetic Compatibility, Singapore,\u00a0May 14-17, 2018, pp. 568-571.<\/li>\n
  8. Inmu\u00a0Kim,\u00a0Kipyoung\u00a0Kim, Youngmin Cho and\u00a0Eakhwan\u00a0Song<\/strong>, “Design Optimization of Board-level Signal Integrity Depending on PCB Stack-up Configuration in a Mobile Device,” in Proceedings of the 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility, Seoul, South Korea, June 20-23, 2017, pp. 334-336.<\/li>\n
  9. Kyungmin Kim<\/strong>, Hyukjun\u00a0Oh\u00a0and\u00a0Eakhwan\u00a0Song<\/strong>, “Modeling of Printed Spiral Coils Based on Conformal Mapping Method With Fringing Capacitance Effects,” in Proceedings of the 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility, Seoul, South Korea, June 20-23, 2017, pp. 362<\/li>\n
  10. Hyun Ho Park and\u00a0Eakhwan\u00a0Song<\/strong>, “Modal Analysis of Radio Frequency Interference From Shield Can Holes in Mobile Devices,” in Proceedings of the 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility, Seoul, South Korea, June 20-23, 2017, pp. 379.<\/li>\n
  11. Hyun Ho Park, Dong Gun Kam, Yong Bae Park, Jiseong Kim, Jae-Deok Lim, Hark-Byeong Park, and Eakhwan Song<\/strong>, “RF Interference Evaluation of Flexible Flat Cables for High-Speed Data Transmission in Mobile Devices,” in Proceedings of the IEEE 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, Edinburgh, UK, November 10-13, 2015, pp. 169-173.<\/li>\n
  12. Eakhwan Song<\/strong>, Hark-Byeong Park and Hyun Ho Park, “An Electromagnetic Interference (EMI) Evaluation Method for Components in Mobile Devices,” in Proceedings of the IEEE International Symposium on Electromagnetic Compatibility, Denver, CO, USA, August 5-9, 2013, pp. 783-786.<\/li>\n
  13. Hongseok Kim, Chiuk Song, Jiseong Kim, Hark Byeong Park, Hyun Ho Park, Eakhwan Song<\/strong> and Joungho Kim, “Optimization procedure of complex permeability for a wireless power transfer system,” in Proceedings of the IEEE Asia-Pacific International Symposium and Exhibition on Electromagnetic Compatibility, Melbourne, Australia, May 20-23, 2013, pp. 414-417.<\/li>\n
  14. Seungyoung Ahn, Hyun Ho Park, Cheol-Seung Choi, Jonghoon Kim, Eakhwan Song,<\/strong> Hark Byung Park, Hongseok Kim, and Joungho Kim, “An Electromagnetic Interference (EMI) Evaluation Method for Components in Mobile Devices,” in Proceedings of the IEEE MTT-S International, Kyoto, Japan, May 10-11, 2012, pp. 65-68.<\/li>\n
  15. Wei-Jiang Zhao, Hark Byeong Park, M. Tan, Hyun Ho Park, En-Xiao Liu, Eakhwan Song,<\/strong> and Er-Ping Li, “Far-field prediction from amplitude-only near-field measurements using equivalent electric currents,” in Proceedings of the IEEE International Symposium on Electromagnetic Compatibility, Pittsburgh, PA, USA, August 6-10, 2012, pp. 590-593.<\/li>\n
  16. Eakhwan Song<\/strong>, Jeonghyeon Cho, Jiseong Kim, Heegon Kim and Joungho Kim, “A Wide-band Passive Equalizer Design Using Multi-layer PCB Parasitics for 30 Gbps Serial Data Transmission,” in Proceedings of the IEEE Asia-Pacific International Symposium and Exhibition on Electromagnetic Compatibility, Jeju, Korea, May 16-19, 2011.<\/li>\n
  17. Hajin Sung, Eakhwan Song<\/strong>, Myounghoi Kim, Yujeong Shim, Sunkyu Kong, Jonghwa Kwon and Joungho Kim, “Design of Toroidal Current Probe Embedded in Multi-layer Printed Circuit Boards for Electrostatic Discharge(ESD) Detection,” in Proceedings of the IEEE Electrical Design of Advanced Packaging & Systems Symposium, Singapore, December 7-9, 2010, p. 1-4.<\/li>\n
  18. Eakhwan Song<\/strong>, Jeonghyeon Cho, Jiseong Kim, and Joungho Kim, “A Compact, Low-cost, and Wide-band Passive Equalizer Design Using Multi-layer PCB Parasitics,” in Proceedings of the IEEE 19th Conference on Electrical Performance of Electronic Packaging, Austin, TX, October 25-27, 2010, pp. 165-168.<\/li>\n
  19. Woojin Lee, Chunghyun Ryu, Jeonghyueon Cho, Eakhwan Song,<\/strong> and Joungho Kim, “A Designated Clock Generation and Distribution (DCGD) Chip Scheme for Substrate Noise-Free 3-D Stacked SiP Design,” in Proceedings of the IEEE Asia-Pacific International Symposium and Exhibition on Electromagnetic Compatibility, Beijing, China, April 12-16, 2010, pp. 334-337.<\/li>\n
  20. Jeonghyeon Cho, Eakhwan Song<\/strong>, Jongjoo Shim, Yujeong Shim and Joungho Kim, “A Fast and Precise Analytical Eye-diagram Estimation Method for a Channel of a Pair of Differential Microstriplines on PCB with Arbitrary Terminations,” in Proceedings of the IEEE Electrical Design of Advanced Packaging & Systems Symposium, Shatin, Hong Kong, December 2-4, 2009.<\/li>\n
  21. Gawon Kim, Eakhwan Song<\/strong>, Jiseong Kim and Joungho Kim, “Precise analysis and modeling of far-end crosstalk and far-end crosstalk saturation using mode analysis in coupled microstrip lines,” in Proceedings of the IEEE Electrical Design of Advanced Packaging & Systems Symposium, Shatin, Hong Kong, December 2-4, 2009, p. 1-4.<\/li>\n
  22. Eakhwan Song<\/strong>, Jeonghyeon Cho, and Joungho Kim, “Hybrid Equalizer Design for 12.5 Gbps Serial Data Transmission,” in Proceedings of the IEEE Conference on Electrical Performance of Electronic Packaging, Portland, OR, USA, October 19-21, 2009, pp. 53-56.<\/li>\n
  23. Joohee Kim, Eakhwan Song<\/strong>, Jeonghyun cho, Jun So Pak, Junho Lee, Hyungdong Lee, Kunwoo Park and Joungho Kim, “Through Silicon Via (TSV) Equalizer,” in Proceedings of the IEEE Conference on Electrical Performance of Electronic Packaging, Portland, OR, USA, October 19-21, 2009, pp. 13-16.<\/li>\n
  24. Jonghyun Cho, Jongjoo Shim, Eakhwan Song<\/strong>, Junso Pak, Junho Lee, Hyungdong Lee, Kunwoo Park and Joungho Kim, “Active Circuit to Through Silicon Via(TSV) Noise Coupling,” in Proceedings of the IEEE Conference on Electrical Performance of Electronic Packaging, Portland, OR, USA, October 19-21, 2009, pp. 97-100.<\/li>\n
  25. Jeonghyeon Cho, Eakhwan Song<\/strong>, Jongjoo Shim, Jiseong Kim and Joungho Kim, “A Precise Analytical Eye-diagram Estimation Method for Non-ideal High-Speed Channels,” in Proceedings of the IEEE Conference on Electrical Performance of Electronic Packaging, Portland, OR, USA, October 19-21, 2009, pp. 159-162.<\/li>\n
  26. Jeonghyeon Cho, Woojin Lee, Eakhwan Song<\/strong>, Jongjoo Shim, Minchul Shin, Changwook Yoon and Joungho Kim, “An On-Chip Spectrum Analyzer for Signal Integrity Estimation of High Speed Serial Links,” in Proceedings of the International Symposium on Electromagnetic Compatibility, Kyoto, Japan, July 20-24, 2009.<\/li>\n
  27. Jeonghyeon Cho, Eakhwan Song<\/strong>, Jongjoo Shim, Gawon Kim, Jiseong Kim and Joungho Kim, “A Precise Analytical Estimation Method of Data-dependent Jitter for High Speed Serial Links with the Consideration of Finite Slew Rate of Input Signal,” in Proceedings of the Korea-Japan Joint Conference, Incheon, Korea, May 14-15, 2009, pp. 215-218.<\/li>\n
  28. Jeonghyeon Cho, Eakhwan Song<\/strong>, Woojin Lee and Joungho Kim, “An On-Chip Signal Integrity Characterization Scheme for Gbps Data Transmission Channel,” in Proceedings of the XXIX General Assembly of International Union of Radio Science, Chicago, IL, USA, August 7-16, 2008.<\/li>\n
  29. Eakhwan Song<\/strong>, Jeonghyun Cho, and Joungho Kim, “Causal Transient Simulation of Magnitude Equalized Signal on High-speed Interconnects,” in Proceedings of the International Workshop on Electromagnetic Compatibility of Integrated Circuits, Torino, Italy, November 28-30, 2007.<\/li>\n
  30. Jaemin Kim, Yujeong Shim, Eakhwan Song<\/strong>, Kyoungchul Koo, and Joungho Kim, “Modelilng of Chip Level Power Distribution Network based on Segmentation Method,” in Proceedings of the International Workshop on Electromagnetic Compatibility of Integrated Circuits, Torino, Italy, November 28-30, 2007.<\/li>\n
  31. Eakhwan Song<\/strong>, Jeonghyun Cho, Dong Gun Kam, and Joungho Kim, “Causality Enforcement in Transient Simulation of HDMI Interconnects with Magnitude Equalization,” in Proceedings of the IEEE International Symposium on Electromagnetic Compatibility, Honolulu, HI, USA, July 9-13, 2007, p. 1-4.<\/li>\n
  32. Eakhwan Song<\/strong>, Junho Lee, Jingook Kim, Dong Gun Kam, Chunghyun Ryu and Joungho Kim, “Estimation of Data-dependent Jitter Using Single Pulse Analysis Method in High-speed Differential Signaling,” in Proceedings of the IEEE Electronics System Integration Technology Conference, Dresden, Germany, September 5-7, 2006, pp. 741-746.<\/li>\n
  33. Jingook Kim, Jiwang Lee, Eakhwan Song<\/strong>, Jeonghyeon Jo and Joungho Kim, “Compensation of Undesired Channel Effects by Frequency Domain Optimization of Pre-emphasis Filter for Over Gbps Signaling,” in Proceedings of the IEEE International Symposium on Electromagnetic Compatibility, Portland, OR, USA, August 14-18, 2006, pp. 721-726.<\/li>\n
  34. Jingook Kim, Jiwang Lee, Eakhwan Song<\/strong>, Jeonghyeon Jo and Joungho Kim, “Design and Analysis of Improved Multi-module Memory Bus Using Wilkinson Power Divider,” in Proceedings of the IEEE International Symposium on Electromagnetic Compatibility, Portland, OR, USA, August 14-18, 2006, pp. 642-645.<\/li>\n
  35. Junho Lee, Youngwon Kim, Eakhwan Song<\/strong> and Joungho Kim, “Partial EBG Power Distribution Network Using Remants of Signal Layers in Multi-layer PCB,” in Proceedings of the IEEE International Symposium on Electromagnetic Compatibility, Portland, OR, USA, August 14-18, 2006, pp. 43-46.<\/li>\n
  36. Eakhwan Song,<\/strong> Junho Lee, Jingook Kim, Dong Gun Kam, Chunghyun Ryu and Joungho Kim, “Data-dependent Jitter Estimation Using Single Pulse Analysis Method,” in Proceedings of the IEEE Electronics Packaging Technology Conference, Singapore, December 7-9, 2005, pp. 810-813.<\/li>\n<\/ol>\n","protected":false},"excerpt":{"rendered":"

    Eakhwan Song, “Impact of Electric Field Coupling on High-frequency Magnetic Probe Calibration,” in Proceedings of 2024 International Symposium on Antennas and Propagation, Incheon, Republic of Korea, November 5-8, 2024. Hyun Ho Park, Jiseong Kim, Eakhwan Song, Hongseok Kim and Sangho Cho, “Influence of Sensing Resistor on IC-level Noise Measurement of DC-DC Converters by 1 \u2126 […]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":20,"menu_order":2,"comment_status":"open","ping_status":"open","template":"page-templates\/front-page.php","meta":[],"_links":{"self":[{"href":"http:\/\/emsl.kw.ac.kr\/index.php?rest_route=\/wp\/v2\/pages\/85"}],"collection":[{"href":"http:\/\/emsl.kw.ac.kr\/index.php?rest_route=\/wp\/v2\/pages"}],"about":[{"href":"http:\/\/emsl.kw.ac.kr\/index.php?rest_route=\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"http:\/\/emsl.kw.ac.kr\/index.php?rest_route=\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"http:\/\/emsl.kw.ac.kr\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=85"}],"version-history":[{"count":24,"href":"http:\/\/emsl.kw.ac.kr\/index.php?rest_route=\/wp\/v2\/pages\/85\/revisions"}],"predecessor-version":[{"id":793,"href":"http:\/\/emsl.kw.ac.kr\/index.php?rest_route=\/wp\/v2\/pages\/85\/revisions\/793"}],"up":[{"embeddable":true,"href":"http:\/\/emsl.kw.ac.kr\/index.php?rest_route=\/wp\/v2\/pages\/20"}],"wp:attachment":[{"href":"http:\/\/emsl.kw.ac.kr\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=85"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}