1. System-level Electromagnetic Compatibility/ Interference (EMC/EMI)

- Inter-system EMI : Radiated Emission/Susceptibility (RE/RS)
- Intra-system EMI : Radio-frequency Interference (RFI)
- Component-level Evaluation of RE/RFI for Mobile Devices
- Sensitivity and Immunity Analysis for Mobile Communication Systems
2. Advanced Electromagnetic Noise Characterization Technologies

- High-sensitivity EM Probe Design (E/H-field)
- Near-field Measurement Techniques : Calibration / Compensation
- Noise Source Characterization and Modeling
3. High-speed Digital System Design (SI/PI)

- Multi-gigabit Interconnects Design : PKG, PCB, Cable, Connector
- Si-interposer/RDL Modeling for Advanced Package Design

- High-speed Signal/Power Integrity (SI/PI) in Chip-PKG-System Co-design
- High-speed Digital Signal Recovery based on Equalization Techniques