1. System-level Electromagnetic Compatibility/ Interference (EMC/EMI)
- Inter-system EMI : Radiated Emission/Susceptibility (RE/RS)
- Intra-system EMI : Radio-frequency Interference (RFI)
- Component-level Evaluation of RE/RFI for Mobile Devices
- Sensitivity and Immunity Analysis for Mobile Communication Systems
2. Advanced Electromagnetic Measurement Technologies
- High-sensitivity EM Probe Design (E/H-field)
- Near-field Measurement Techniques : Calibration / Compensation
- Noise Source Characterization and Modeling
3. High-speed Digital System Design
- Signal/Power Integrity (SI/PI) in Chip-PKG-PCB Co-design
- Multi-gigabit Interconnects Design : PCB, PKG, Cable, Connector
- High-speed Digital Signal Recovery based on Equalization Techniques
- Signal/Power Integrity (SI/PI) in Mixed-signal Systems (Digital + RF)