PROJECTS

2024

  • Development of an Electrical Analysis Software for High-Density Interposer and Bridge Die Design in 2.xD High-Performance Systems, Korea Technology and Information Promotion Agency for SMEs (TIPA), 2024.08-2025.07
  • Development of Advanced Power and Signal EMC Technologies for Hyper-connected E-Vehicle, Institute of Information & Communications Technology Planning & Evaluation (IITP), 2024.01 – 2024.12
  • Title Classified, Korea Research Institute for Defense Technology Planning and Advancement (KRIT), 2024.01 – 2024.12

2023

  • Development of Advanced Power and Signal EMC Technologies for Hyper-connected E-Vehicle, Institute of Information & Communications Technology Planning & Evaluation (IITP), 2023.01 – 2023.12
  • Title Classified, Korea Research Institute for Defense Technology Planning and Advancement (KRIT), 2023.01 – 2023.12
  • Development of Simulation and Analysis Method for Signal Integrity and Power Integrity (SI/PI) in High-speed Package Design, HANA Micron, 2022.10-2023.09

2022

  • Development of 5G-band Performance Evaluation Method for Electromagnetic Shielding Materials and Components for Improvement of Electromagnetic Immunity In Hyper-connected Internet of Things (IoT) Environment, National Research Foundation (NRF), 2022.03 – 2023.02
  • Development of Advanced Power and Signal EMC Technologies for Hyper-connected E-Vehicle, Institute of Information & Communications Technology Planning & Evaluation (IITP), 2022.01 – 2022.12

2021

  • Development of 5G-band Performance Evaluation Method for Electromagnetic Shielding Materials and Components for Improvement of Electromagnetic Immunity In Hyper-connected Internet of Things (IoT) Environment, National Research Foundation (NRF), 2021.03 – 2022.02
  • Development of Advanced Power and Signal EMC Technologies for Hyper-connected E-Vehicle, Institute of Information & Communications Technology Planning & Evaluation (IITP), 2021.01 – 2021.12

2020

  • Development of 5G-band Performance Evaluation Method for Electromagnetic Shielding Materials and Components for Improvement of Electromagnetic Immunity In Hyper-connected Internet of Things (IoT) Environment, National Research Foundation (NRF), 2020.06 – 2021.02
  • Development of Advanced Power and Signal EMC Technologies for Hyper-connected E-Vehicle, Institute of Information & Communications Technology Planning & Evaluation (IITP), 2020.04 – 2020.12

2019

  • Development of Performance Evaluation and Modeling Methods for High-power Electromagnetic Protection Devices, Electronics and Telecommunications Research Institute (ETRI), 2019.03 – 2019.11
  • Development of High-frequency and High-sensitivity Noise Measurement Technologies for Electromagnetic Interference (EMI) Analysis on Internet of Things (IoT) Devices, National Research Foundation (NRF), 2019.03 – 2020.02

2018

  • Research on Train-to-Train Communication Sensitivity Improvement, Korea Railroad Research Institute (KRRI), 2018.05 – 2017.11
  • Development of High-frequency and High-sensitivity Noise Measurement Technologies for Electromagnetic Interference (EMI) Analysis on Internet of Things (IoT) Devices, National Research Foundation (NRF), 2018.03 – 2019.02

2017

  • Modeling and Evaluation of Conducted Electromagnetic Susceptibility, Electronics and Telecommunications Research Institute (ETRI), 2017.09 – 2018.04
  • Development of High-frequency and High-sensitivity Noise Measurement Technologies for Electromagnetic Interference (EMI) Analysis on Internet of Things (IoT) Devices, National Research Foundation (NRF), 2017.03 – 2018.02
  • Title Classified, National Security Research Institute, 2017.04 – 2017.10
  • Research on Train-to-Train Communication Sensitivity Improvement, Korea Railroad Research Institute (KRRI), 2017.04 – 2017.11

2016

  • Title Classified, National Security Research Institute, 2016.04 – 2016.10

2015

  • Design Guideline Development for Low-power and High-speed ATE Interface Boards, SK Hynix, 2015.04 – 2016.03
  • Development of Far-field EMI Evaluation Method of Shield Cans in Mobile Devices, SAMSUNG Electronics, 2015.04 – 2015.10
  • Title Classified, National Security Research Institute, 2015.04 – 2015.10

2014

  • Development of IC-level Electromagnetic Interference Evaluation Methodology, SAMSUNG Electronics, 2014.10 – 2015.03